The next major Mac Studio update is still a couple of years away, but a refresh for 2026 is still in the cards, according to Bloomberg's Mark Gurman.


Writing in the latest edition of his Power On newsletter, Gurman said Apple has two Mac Studio refreshes in the pipeline: an M5 Ultra version due this year, and a more significant M7 Ultra model expected in 2028.

Apple appears set to skip the higher-end M6 chips entirely, hence the two-year gap between the two models. Gurman reported earlier this month that Apple is canceling its higher-end M6 Pro and M6 Max chips, instead releasing a base M6 this year and moving its next Pro and Max silicon to the M7 lineup, which is expected to lean heavily into on-device AI and GPU-intensive workloads.

Apple has always had at least three variants of its in-house silicon, including the base M-series chip, a Pro version, and a Max version. The M6 will mark the first time that Apple is not coming out with a Pro or Max chip for the lineup.

For the Mac Studio, that means jumping straight from M5 Ultra to M7 Ultra – there will be no M6 Ultra in between. While a major redesign is not expected for this year's M5 Ultra model, Gurman says Apple has been developing new inner architecture for the 2028 Mac Studio, including a better heat sink to improve thermal performance.

The ‌Mac Studio‌ refresh was supposed to come earlier in 2026, but Apple reportedly postponed the launch because of memory chip supply issues and price increases. Apple has reportedly tested support for up to 768GB of unified memory, but supply constraints could prevent it from launching with an option for that much memory.

It remains unclear whether Apple will make an October launch for the M5 version, especially given that the current M3 Ultra ‌Mac Studio‌ still has delivery estimates stretching into October.
This article, "Mac Studio M7 Ultra Expected in 2028 With Better Cooling" first appeared on MacRumors.com

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An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip will use a new packaging technology that should offer notable performance gains over the previous model.


The leaked image, which has been shared by the accounts "WHYLAB" and "Ice Universe" on Weibo, appears to show the A20 Pro chip integrated into TSMC's new packaging architecture, known as Wafer-Level Multi-Chip Module (WMCM) technology.

Traditionally, Apple has used package-on-package (PoP) designs, where the DRAM sits directly on top of the application processor. The advantages of this method are lower power consumption and reduced latency, but it also makes heat concentrated in the packaging area.

In the leaked WMCM implementation, by contrast, the DRAM has been moved to the side of the package, which should reduce thermal coupling between the processor and DRAM while improving heat dissipation during sustained workloads. Apple's design is also said to be equipped with LPDDR6 memory with a 96-bit memory bus, which should provide more energy-efficient bandwidth.

The chip size is said to be roughly the same as the A19 Pro, but the Neural Processing Unit (NPU) appears to be significantly larger, suggesting that Apple is also aiming to improve AI performance.

The leaked image has not been confirmed as authentic, but the WMCM technology has been repeatedly rumored for the iPhone 18 Pro and iPhone 18 Pro Max.

Powered by the A20 Pro chip, the foldable iPhone and iPhone 18 Pro models are also expected to use TSMC's new 2nm process, also known as N2, boasting performance improvements that could be up to 15 percent faster and 30 percent more efficient than A19 chips.


In addition, N2 introduces new super-high-performance metal-insulator-metal (SHPMIM) capacitors into the chip's power delivery system. These capacitors more than double the capacitance density of the previous generation. Together with the adoption of WMCM, the changes should boost performance globally and improve power stability and energy efficiency.

The Pro and Fold models are expected to share 12GB of RAM, 48-megapixel rear cameras, and Apple's C2 modem. All three models are expected to be released in September this year.
This article, "Leaked A20 Pro Image Hints at iPhone 18 Pro Performance Gains" first appeared on MacRumors.com

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Apple's upcoming iPhone 18e will have the same display refresh rate as the existing iPhone 17e, according to a prominent Chinese leaker.


Discussing Apple's product plans for 2027 in a Weibo post, Digital Chat Station claimed that the next generation of Apple's low-cost iPhone will feature the same 60Hz low-temperature polycrystalline silicon (LTPS) TFT panel as the current model.

It means the device will lack the ProMotion 120Hz refresh rate and Always-On display technology that is expected to feature across the rest of the iPhone 18 lineup, similar to the iPhone 17 series.

That's despite the fact that you can find 120Hz screens on competing Android phones at similar price points as the iPhone 17e.

The claim is substantiated by a report out of Korea earlier this year that said Apple would not use a low-temperature polycrystalline oxide (LTPO) panel until the fourth-generation model, which is expected to arrive in early 2028. Adoption of LPTO would make the display technically capable of dynamically adjusting its refresh rate between 1Hz and 120Hz.

The shift in 2028 is said to depend in part on Apple's development of a next-generation "LTPO+" display technology, which incorporates oxide semiconductors in both switching and drive transistors, and is said to use a lot less battery power.

Apple reportedly plans to reserve LTPO+ for its higher-end models in 2028, including new versions of the iPhone Air and its upcoming foldable iPhone, which would free up standard LTPO panels for the rest of the lineup. But if the new technology isn't ready in time, it could delay the trickle-down of LPTO panels to the 19e, so nothing's for certain yet.
This article, "iPhone 18e Won't Get ProMotion Display, Says Leaker" first appeared on MacRumors.com

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